Patent Assignment
Reel/Frame 056944/0697
Assignment of Assignor's Interest
Recorded: 2021-07-22
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Atomic Layer Deposition Bonding Layer for Joining Two Semiconductor Devices