Patent Assignment
Reel/Frame 056962/0551
Assignment of Assignor's Interest
Recorded: 2021-07-23
Pages: 3
Assignors
HUANG, KUAN-YU
Executed: 2021-07-22
KUO, LI-CHUNG
Executed: 2021-07-18
HUANG, SUNG-HUI
Executed: 2021-07-15
HOU, SHANG-YUN
Executed: 2021-07-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages With Multiple Types of Underfill and Method Forming The Same