Patent Assignment
Reel/Frame 056963/0108
Assignment of Assignor's Interest
Recorded: 2021-07-23
Pages: 2
Assignor
SETTA, YUJI
Executed: 2021-07-06
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having a Plurality of First Structural Bodies Provided Below a Connection Terminal and Manufacturing Method Thereof