Patent Assignment
Reel/Frame 056975/0490
Assignment of Assignor's Interest
Recorded: 2021-07-26
Pages: 14
Assignors
KIM, JONGHAE
Executed: 2021-04-21
SHAH, MILIND
Executed: 2021-04-11
CHIDAMBARAM, PERIANNAN
Executed: 2021-04-23
LANGARI, ABDOLREZA
Executed: 2021-04-29
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Integrated Circuit Assembly with Hybrid Bonding