Patent Assignment
Reel/Frame 056998/0388
Assignment of Assignor's Interest
Recorded: 2021-07-27
Pages: 4
Assignors
LIANG, YU-EN
Executed: 2021-06-22
SUN, CHIA-PENG
Executed: 2021-06-22
HSU, CHIH-CHUNG
Executed: 2021-06-22
CHANG, RONG-YEU
Executed: 2021-06-22
HSU, CHIA-HSIANG
Executed: 2021-06-22
Assignee
CORETECH SYSTEM CO., LTD.
8F.-2, NO. 32, TAIYUAN ST., ZHUBEI CITY, HSINCHU COUNTY, 302, TAIWAN
Covered Property
(1)
Method of Measuring Underfill Profile of Underfill Cavity Having Solder Bumps
Patent:
11,355,361 →
Application:
17/381,515 →