Patent Assignment
Reel/Frame 056999/0970
Assignment of Assignor's Interest
Recorded: 2021-07-28
Pages: 3
Assignor
STEINHOFF, STEFAN
Executed: 2021-03-18
Assignee
LITTELFUSE, INC.
8755 WEST HIGGINS ROAD, SUITE 500, CHICAGO, ILLINOIS, 60631
Covered Property
(1)
Semiconductor Chip Package and Method of Assembly