Patent Assignment
Reel/Frame 057006/0011
Assignment of Assignor's Interest
Recorded: 2021-07-28
Pages: 7
Assignors
YOU, JIA-CHUAN
Executed: 2020-01-30
CHANG, CHIA-HAO
Executed: 2020-01-30
LIN, TIEN-LU
Executed: 2020-03-01
LIN, YU-MING
Executed: 2020-02-04
WANG, CHIH-HAO
Executed: 2020-02-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Butted Contacts and Methods of Fabricating the Same in Semiconductor Devices