Patent Assignment
Reel/Frame 057008/0179
Assignment of Assignor's Interest
Recorded: 2021-07-28
Pages: 5
Assignors
CHIU, SHIH-CHUAN
Executed: 2020-08-13
CHANG, CHIA-HAO
Executed: 2020-08-13
CHUANG, CHENG-CHI
Executed: 2020-08-14
WANG, CHIH-HAO
Executed: 2020-08-18
LIN, YU-MING
Executed: 2020-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure Having a Multi-Deck Conductive Feature and Method of Forming the Same
Application:
16/901,749 →
Publication:
US 2021/0391438