Patent Assignment
Reel/Frame 057012/0011
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 4
Assignors
CHEN, CHIN-LIANG
Executed: 2021-06-23
HO, KUAN-LIN
Executed: 2021-06-27
NI, PEI-RONG
Executed: 2021-07-16
LIN, CHIA-MIN
Executed: 2021-06-23
LIANG, YU-MIN
Executed: 2021-06-24
WU, JIUN-YI
Executed: 2021-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same