Patent Assignment
Reel/Frame 057017/0803
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 2
Assignor
IKEDA, KOSUKE
Executed: 2021-07-29
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Substrate and Method for Manufacturing Wiring Substrate