Patent Assignment
Reel/Frame 057023/0236
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 4
Assignors
CHENG, JUNG-CHIEN
Executed: 2021-04-13
CHIANG, KUO-CHENG
Executed: 2021-04-17
JU, SHI NING
Executed: 2021-04-13
CHEN, GUAN-LIN
Executed: 2021-04-13
WANG, CHIH-HAO
Executed: 2021-04-13
CHENG, KUAN-LUN
Executed: 2021-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Gap-Insulated Semiconductor Device