Patent Assignment
Reel/Frame 057024/0210
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Dicing Wafer Forming Modified Layer in Chucked Wafer