IP Library › Assignment 057026/0807
Patent Assignment
Reel/Frame 057026/0807

Assignment of Assignor's Interest

Recorded: 2021-07-29 Pages: 4
Assignors
LEE, CHIEN-CHI
Executed: 2021-06-24
HSIA, JYAN-ANN
Executed: 2021-06-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property (1)
Semiconductor Package Structure
Application: 17/357,851 →
Publication: US 2022/0415851