Patent Assignment
Reel/Frame 057027/0704
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 4
Assignors
CHENG, KUAN-HAO
Executed: 2021-07-21
LEE, WEI-YANG
Executed: 2021-07-21
CHIU, TZU-HUA
Executed: 2021-07-18
FAN, WEI-HAN
Executed: 2021-07-21
LIN, PO-YU
Executed: 2021-07-21
LIN, CHIA-PIN
Executed: 2021-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same