Patent Assignment
Reel/Frame 057030/0846
Assignment of Assignor's Interest
Recorded: 2021-07-30
Pages: 4
Assignors
CHEN, KAI-HENG
Executed: 2021-01-18
TSAO, PEI-HAW
Executed: 2021-01-05
LEU, SHYUE-TER
Executed: 2021-01-05
WANG, RUNG-DE
Executed: 2021-01-05
WANG, CHIEN-CHUN
Executed: 2021-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Level Package with Polymer Layer Delamination Prevention Design and Method of Forming the Same