Patent Assignment
Reel/Frame 057031/0385
Assignment of Assignor's Interest
Recorded: 2021-07-30
Pages: 5
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Composite Ic Die Package Including Ic Die Directly Bonded to Front and Back Sides of an Interposer
Application:
17/389,649 →
Publication:
US 2023/0034737