Patent Assignment
Reel/Frame 057032/0972
Assignment of Assignor's Interest
Recorded: 2021-07-30
Pages: 3
Assignor
SHIH, HUNG-LING
Executed: 2020-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming a Deep Trench Isolation Structure for Isolation of High-Voltage Devices