Patent Assignment
Reel/Frame 057050/0966
Assignment of Assignor's Interest
Recorded: 2021-08-02
Pages: 4
Assignors
MARIANI, SIMONE DARIO
Executed: 2021-07-27
PIZZI, ELISABETTA
Executed: 2021-07-23
DORIA, DARIA
Executed: 2021-07-19
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA (MB), 20864, ITALY
Covered Property
(1)
Integrated Circuit Chip Including a Passivation Nitride Layer in Contact with a High Voltage Bonding Pad and Method of Making