Patent Assignment
Reel/Frame 057053/0977
Assignment of Assignor's Interest
Recorded: 2021-08-02
Pages: 4
Assignors
CHUN, HEE SUN
Executed: 2021-04-16
NAM, HONG GI
Executed: 2021-04-16
LEE, JE HEE
Executed: 2021-04-16
HONG, JI SU
Executed: 2021-04-16
BAIK, SEUNG IN
Executed: 2021-04-16
PARK, JAE SUNG
Executed: 2021-04-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Dielectric Composition and Multilayer Electronic Component Including the Same