Patent Assignment
Reel/Frame 057058/0070
Assignment of Assignor's Interest
Recorded: 2021-08-02
Pages: 16
Assignors
HA, CHANG WAN
Executed: 2021-05-24
THIMMEGOWDA, DEEPAK
Executed: 2021-05-24
KOH, HOON
Executed: 2021-05-31
GULARTE, RICHARD M.
Executed: 2021-05-25
LIU, LIU
Executed: 2021-05-29
MEYAARD, DAVID
Executed: 2021-06-04
RAHMAN, AHSANUR
Executed: 2021-05-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Split Block Array for 3D Nand Memory
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignor Hoon Koh Signature Was Dated Incorrectly as 05/31/2012 and Should Be 05/31/2021 Previously Recorded on Reel 057058 Frame 0070. Assignor(S) Hereby Confirms the Date of Signature for Assignor Hoon Koh Is 05/31/2021.
Mar 24, 2022
From: HA, CHANG WAN; THIMMEGOWDA, DEEPAK; KOH, HOON; GULARTE, RICHARD M.
To: INTEL CORPORATION
Reel/Frame 060251/0579 →
Assignment of Assignor's Interest
May 2, 2024
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 067305/0491 →