Patent Assignment
Reel/Frame 057061/0787
Assignment of Assignor's Interest
Recorded: 2021-08-03
Pages: 3
Assignors
CHANG, CHING-YU
Executed: 2021-06-21
CHEN, JEI-MING
Executed: 2021-06-21
LEE, TZE-LIANG
Executed: 2021-07-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device