Patent Assignment
Reel/Frame 057070/0081
Assignment of Assignor's Interest
Recorded: 2021-08-03
Pages: 14
Assignors
SMITH, JEFFREY
Executed: 2021-07-06
CHANEMOUGAME, DANIEL
Executed: 2021-07-01
LIEBMANN, LARS
Executed: 2021-07-01
GUTWIN, PAUL
Executed: 2021-07-02
CLARK, ROBERT
Executed: 2021-06-30
DEVILLIERS, ANTON
Executed: 2021-07-30
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of 3D Logic Fabrication to Sequentially Decrease Processing Temperature and Maintain Material Thermal Thresholds