Patent Assignment
Reel/Frame 057073/0296
Assignment of Assignor's Interest
Recorded: 2021-08-03
Pages: 3
Assignors
LIM, TAEHYUNG
Executed: 2021-06-23
KOO, JONGHOE
Executed: 2021-06-23
YOON, KANGJIN
Executed: 2021-06-23
LEE, DUCKEY
Executed: 2021-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Methods for Linkage of or Profile Transfer Between Devices