Patent Assignment
Reel/Frame 057081/0363
Assignment of Assignor's Interest
Recorded: 2021-08-04
Pages: 8
Assignors
YIM, CHOONGBIN
Executed: 2021-05-26
KIM, DONGWOOK
Executed: 2021-05-16
KIM, HYUNKI
Executed: 2021-05-26
SHIM, JONGBO
Executed: 2021-05-26
KIM, JIHWANG
Executed: 2021-05-26
PARK, SUNGKYU
Executed: 2021-05-26
LEE, YONGKWAN
Executed: 2021-05-26
JANG, BYOUNGWOOK
Executed: 2021-05-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer and Semiconductor Package Including the Same