Patent Assignment
Reel/Frame 057084/0353
Assignment of Assignor's Interest
Recorded: 2021-08-04
Pages: 3
Assignors
YU, CHI-YANG
Executed: 2021-07-11
LIANG, YU-MIN
Executed: 2021-07-07
WU, JIUN-YI
Executed: 2021-07-07
LEE, CHIEN-HSUN
Executed: 2021-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same