IP Library › Assignment 057090/0256
Patent Assignment
Reel/Frame 057090/0256

Assignment of Assignor's Interest

Recorded: 2021-08-05 Pages: 10
Assignors
SIDDIQUE, RADWANUL HASAN
Executed: 2020-06-23
ASSUMPCAO, DANIEL
Executed: 2020-06-23
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
CALIFORNIA INSTITUTE OF TECHNOLOGY
1200 E CALIFORNIA BLVD., MC 6-32, PASADENA, CALIFORNIA, 91125
Covered Property (1)
Dispersion Array and Method of Fabricating
Application: 16/914,254 →
Publication: US 2021/0223444