Patent Assignment
Reel/Frame 057093/0258
Assignment of Assignor's Interest
Recorded: 2021-08-05
Pages: 7
Assignors
CHOI, JIHONG
Executed: 2021-07-27
SONG, STANLEY SEUNGCHUL
Executed: 2021-07-26
NALLAPATI, GIRIDHAR
Executed: 2021-07-26
CHIDAMBARAM, PERIANNAN
Executed: 2021-07-28
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Deep Trench Capacitors in an Inter-Layer Medium on an Interconnect Layer of an Integrated Circuit Die and Related Methods