Patent Assignment
Reel/Frame 057105/0264
Assignment of Assignor's Interest
Recorded: 2021-08-06
Pages: 4
Assignors
YOU, JIA-CHUAN
Executed: 2021-07-27
CHANG, CHIA-HAO
Executed: 2021-07-27
PAN, KUAN-TING
Executed: 2021-07-27
JU, SHI-NING
Executed: 2021-07-27
CHIANG, KUO-CHENG
Executed: 2021-07-27
WANG, CHIH-HAO
Executed: 2021-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Manufacturing Semiconductor Structure with Dielectric Feature