Patent Assignment
Reel/Frame 057125/0690
Assignment of Assignor's Interest
Recorded: 2021-08-09
Pages: 3
Assignors
CHENG, YUN-WEI
Executed: 2017-12-26
CHOU, CHUN-HAO
Executed: 2017-12-26
LEE, KUO-CHENG
Executed: 2017-12-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device