IP Library › Assignment 057128/0566
Patent Assignment
Reel/Frame 057128/0566

Assignment of Assignor's Interest

Recorded: 2021-08-10 Pages: 3
Assignor
YAMAZAKI, RYOSUKE
Executed: 2019-01-24
Assignee
DOW CORNING TORAY CO., LTD.
5-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property (1)
Curable Particulate Silicone Composition, Semiconductor Member Comprising Curable Particulate Silicone Composition, and Method for Molding Semiconductor Member
Application: 16/324,018 →
Publication: US 2019/0177488
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →