Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member
Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.
1. A curable particulate silicone composition comprising:
(A) a hot-meltable silicone particle that has a softening point of 30° C. or higher and has a hydrosilylatable group and/or a radical reactive group;
(B) an inorganic filler that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and
(C) a curing agent;
wherein component (B) contains an inorganic filler (b1) that is fumed silica (b1-1) and having an average particle diameter of 0.1 μm or lower, and an inorganic filler (b2) having an average particle diameter of 0.1 to 5.0 μm at a mass ratio of 1/99 to 50/50; and
wherein when cured, the curable particulate silicone composition provides a cured product having a storage modulus (G′) of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.
2. The curable particulate silicone composition according to claim 1 , wherein component (B) is a filler that has no softening point or does not soften at the softening point of component (A) or lower.
3. The curable particulate silicone composition according to claim 1 , wherein component (B) is an inorganic filler that is substantially free of coarse particles having an average particle diameter of 5.0 μm or larger.
4. The curable particulate silicone composition according to claim 1 , wherein component (B) is selected from the group consisting of a reinforcing filler, a white pigment, a thermal conductive filler, an electrical conductive filler, a phosphor, and mixtures thereof.
5. The curable particulate silicone composition according to claim 1 , wherein component (b2) is fused silica (b2-1).
6. The curable particulate silicone composition according to claim 1 , wherein component (A) is selected from the group consisting of a silicone particulate composed of resinoid organopolysiloxane (A 1 ), an organopolysiloxane cross-linked product (A 2 ) formed by partially cross-linking at least one organopolysiloxane, a block copolymer (A 3 ) consisting of a resinoid organosiloxane block and a chain organosiloxane block, and mixtures thereof.
7. The curable particulate silicone composition according to claim 1 , wherein component (A) is a completely-spherical silicone particulate having an average primary particle diameter of 1 to 10 μm, and 10 mol % or higher of a silicon-bonded organic group in component (A) is an aryl group.
8. The curable particulate silicone composition according to claim 1 , wherein the content of component (B) is 10 to 2000 parts by mass with respect to 100 parts by mass of component (A).
9. The curable particulate silicone composition according to claim 1 , wherein the curable particulate silicone composition is in the form of pellet or sheet.
10. A method of molding a cured product, the method comprising:
(I) heating the curable particulate silicone composition according to claim 1 to the softening point of component (A) or higher to melt the curable particulate silicone composition;
(II) injecting the curable silicone composition acquired in step (I) into a mold or spreading the curable silicone composition acquired in step (I) in a mold by clamping; and
(III) curing the curable silicone composition injected or spread in step (II).
11. The method of molding according to claim 10 , further comprising simultaneously overmolding and underfilling of a semiconductor element with the curable particulate silicone composition.
12. The method of molding according to claim 10 , further comprising coating the surface of a semiconductor wafer substrate that mounts one or more semiconductor elements with the curable particulate silicone composition, and performing overmolding so as to fill a gap between the semiconductor elements.