Patent Assignment
Reel/Frame 057131/0307
Assignment of Assignor's Interest
Recorded: 2021-08-09
Pages: 3
Assignor
KAMGAING, TELESPHOR
Executed: 2021-06-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate Including Core with Trench Vias and Planes
Application:
17/339,420 →
Publication:
US 2022/0394858
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.