IP Library › Assignment 057137/0157
Patent Assignment
Reel/Frame 057137/0157

Assignment of Assignor's Interest

Recorded: 2021-08-10 Pages: 3
Assignors
BANG, BYUNG JUN
Executed: 2021-08-04
EOM, JU IL
Executed: 2021-08-04
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Semiconductor Module Including the Same
Application: 17/398,646 →
Publication: US 2022/0336420