Patent Assignment
Reel/Frame 057157/0628
Assignment of Assignor's Interest
Recorded: 2021-08-12
Pages: 4
Assignors
HUANG, SIN-YAO
Executed: 2021-08-12
SHIH, HUNG-LING
Executed: 2021-04-19
WU, KUO-MING
Executed: 2021-04-19
HSU, HUNG-WEN
Executed: 2021-04-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stilted Pad Structure