Patent Assignment
Reel/Frame 057157/0765
Assignment of Assignor's Interest
Recorded: 2021-08-12
Pages: 4
Assignors
LIN, TZU-YU
Executed: 2021-06-03
CHANG, YAO-WEN
Executed: 2021-08-12
ZHONG, CHIA-WEN
Executed: 2021-06-02
LIN, YEN-LIANG
Executed: 2021-06-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming an Upper Conductive Structure Having Multilayer Stack to Decrease Fabrication Costs and Increase Performance