Patent Assignment
Reel/Frame 057167/0127
Assignment of Assignor's Interest
Recorded: 2021-08-12
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof