Patent Assignment
Reel/Frame 057169/0672
Assignment of Assignor's Interest
Recorded: 2021-08-13
Pages: 6
Assignors
TSAI, CHEN-FONG
Executed: 2021-06-14
TENG, YUN CHEN
Executed: 2021-06-17
CHEN, HAN-DE
Executed: 2021-06-17
SHEU, JYH-CHERNG
Executed: 2021-08-12
CHANG, HUICHENG
Executed: 2021-06-14
YEO, YEE-CHIA
Executed: 2021-06-17
CHANG, CHIEH
Executed: 2021-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding System with Sealing Gasket and Method for Using the Same