Patent Assignment
Reel/Frame 057181/0057
Assignment of Assignor's Interest
Recorded: 2021-08-15
Pages: 3
Assignors
CHEN, CHIH-HAO
Executed: 2021-07-23
CHENG, PO-YUAN
Executed: 2021-07-26
WANG, PU
Executed: 2021-07-23
CHENG, LI-HUI
Executed: 2021-07-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof