Patent Assignment
Reel/Frame 057182/0175
Assignment of Assignor's Interest
Recorded: 2021-08-16
Pages: 8
Assignors
SHIN, HYEONJIN
Executed: 2021-08-09
KIM, SANGWON
Executed: 2021-08-09
BYUN, KYUNG-EUN
Executed: 2021-08-09
SONG, HYUNJAE
Executed: 2021-08-09
SHIN, KEUNWOOK
Executed: 2021-08-09
LEE, EUNKYU
Executed: 2021-08-09
LEE, CHANGSEOK
Executed: 2021-08-09
CHO, YEONCHOO
Executed: 2021-08-09
CHOI, TAEJIN
Executed: 2021-08-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnect Structure to Reduce Contact Resistance, Electronic Device Including the Same, and Method of Manufacturing the Interconnect Structure