Patent Assignment
Reel/Frame 057196/0026
Assignment of Assignor's Interest
Recorded: 2021-08-17
Pages: 3
Assignors
HSIEH, CHENG-YEN
Executed: 2020-11-22
CHANG, CHIH-HORNG
Executed: 2020-11-23
LU, CHUNG-YU
Executed: 2020-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Comprising a Semiconductor Die with a Thermoelectric Structure and Manufacturing Method Thereof