Patent Assignment
Reel/Frame 057205/0633
Assignment of Assignor's Interest
Recorded: 2021-08-17
Pages: 3
Assignors
CHANG, KUANG-HUNG
Executed: 2020-05-12
HOU, YUAN-TE
Executed: 2020-05-12
WANG, CHUNG-HSING
Executed: 2020-05-12
HOU, YUNG-CHIN
Executed: 2020-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit with Thicker Metal Lines on Lower Metallization Layer