Patent Assignment
Reel/Frame 057207/0494
Assignment of Assignor's Interest
Recorded: 2021-08-18
Pages: 3
Assignors
HSIEH, PING-YIN
Executed: 2020-12-06
CHENG, LI-HUI
Executed: 2020-12-06
WANG, PU
Executed: 2020-12-07
LU, SZU-WEI
Executed: 2020-12-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof