Patent Assignment
Reel/Frame 057215/0274
Assignment of Assignor's Interest
Recorded: 2021-08-18
Pages: 6
Assignors
KO, YEONGKWON
Executed: 2021-08-13
PARK, JINWOO
Executed: 2021-08-13
YOO, JAEKYUNG
Executed: 2021-08-13
LEE, TAEKHOON
Executed: 2021-08-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Mold Layer and Manufacturing Method Thereof