Patent Assignment
Reel/Frame 057216/0394
Assignment of Assignor's Interest
Recorded: 2021-08-18
Pages: 4
Assignors
WU, XUSHENG
Executed: 2021-04-06
LEUNG, YING-KEUNG
Executed: 2020-07-14
SHANG, HUILING
Executed: 2020-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with S/D Bottom Isolation and Methods of Forming the Same