Patent Assignment
Reel/Frame 057217/0127
Assignment of Assignor's Interest
Recorded: 2021-08-18
Pages: 3
Assignors
IMAI, TOMOHIRO
Executed: 2021-05-23
NAKAZAWA, YOSHITO
Executed: 2021-06-10
EIKYU, KATSUMI
Executed: 2021-05-23
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOTO-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same