Patent Assignment
Reel/Frame 057221/0669
Assignment of Assignor's Interest
Recorded: 2021-08-19
Pages: 3
Assignors
LIN, TSUNG-SHU
Executed: 2021-08-18
HUNG, WENSEN
Executed: 2021-08-18
CHEN, TSUNG-YU
Executed: 2021-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Lid Structure