Patent Assignment
Reel/Frame 057236/0716
Assignment of Assignor's Interest
Recorded: 2021-08-20
Pages: 4
Assignors
LI, YU-HSIEN
Executed: 2021-08-02
CHIANG, YEN-TING
Executed: 2021-08-02
TING, SHYH-FANN
Executed: 2021-08-02
LIU, JEN-CHENG
Executed: 2021-08-02
YAUNG, DUN-NIAN
Executed: 2021-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bond Pad Structure with High via Density