Patent Assignment
Reel/Frame 057239/0083
Assignment of Assignor's Interest
Recorded: 2021-08-20
Pages: 4
Assignors
CHEN, YU-HAO
Executed: 2021-08-08
CHANG, FONG-YUAN
Executed: 2021-08-09
HUANG, PO-HSIANG
Executed: 2021-08-19
LIN, CHING-YI
Executed: 2021-08-08
LEE, JYH CHWEN FRANK
Executed: 2021-08-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Info Packages Including Thermal Dissipation Blocks