Patent Assignment
Reel/Frame 057268/0481
Assignment of Assignor's Interest
Recorded: 2021-08-24
Pages: 4
Assignors
CHEN, CHIA-WEI
Executed: 2021-08-11
LAI, CHI-SHENG
Executed: 2021-08-11
LIN, SHIH-HAO
Executed: 2021-08-11
CHEN, JIAN-HAO
Executed: 2021-08-11
YU, KUO-FENG
Executed: 2021-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same