IP Library › Assignment 057278/0219
Patent Assignment
Reel/Frame 057278/0219

Change of Name

Recorded: 2021-05-21 Pages: 10
Assignor
Assignee
HD MICROSYSTEMS, LTD.
4-25, KORAKU 1-CHOME, BUNKYO-KU, TOKYO, 112-0004, JAPAN
Covered Property (1)
Positive Photosensitive Resin Composition, Patterned Cured Film Production Method, Patterned Cured Film, and Electronic Component
Application: 15/545,751 →
Publication: US 2018/0074403
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 1, 2017
From: MATSUKAWA, DAISAKU; ENOMOTO, TETSUYA
To: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Reel/Frame 044008/0292 →